Micron announces the sampling of its new HBM3 Gen2 memory
Micron announces the sampling of its new HBM3 Gen2 memory, which the company says is the fastest and most power efficient in the world. It’s also the first to offer a stack with 24GB of capacity, a 50% boost over standard HBM3.
The new memory is a generational leap in performance, capacity, and power efficiency. Micron says the new 8-high stack delivers 50% higher bandwidth at 1.2 TB/s with a 1024-bit wide memory bus, outperforming current HBM3 memory. It’s also the most power efficient, offering a 2.5x improvement-per-watt compared to the company’s previous-gen HBM2E.
In many ways, this is the ideal memory for the current AI arms race. It’s faster, it’s more efficient, and it’s available now. It’s also compatible with standard CoWoS packaging, commonly used for GPUs and accelerators.
Micron’s roadmap includes the future release of ‘HBMNext,’ potentially HBM4, but we don’t yet have a clear picture of what that will be. Micron does say that it expects 2+ TB/s of throughput and up to 64GB of capacity by 2026.
Check out the full press release below:
“Micron’s new HBM3 Gen2 memory builds on the company’s legacy of memory leadership,” says Jim Barbee, vice president of Micron Memory Products. “It represents a generational leap in performance, capacity, and power efficiency, positioning Micron to meet the needs of next-generation high-performance systems.”
Highlights of Micron’s HBM3 Gen2 include:
Micron’s HBM3 Gen2 is currently sampling to partners for 8-high stacks, with 12-high stacks arriving soon. High volume production of Micron’s HBM3 Gen2 is scheduled to begin in 2024.
If you want to learn more about the current state of HBM3, we’ve got you covered. Check out our in-depth HBM3 guide for all the latest on the fastest VRAM around. You can also take a look at the best graphics card around right now, with our picks serving up plenty of power to handle the best Oculus Rift games.
