Micron's Roadmap for Faster and Higher-Capacity Memory Solutions
Micron’s memory roadmap for 2024 includes 32GB DDR5 memory chips, which the company says will contribute to faster and higher-capacity memory solutions. The tech will benefit datacenters and other high-performance applications, as Micron tries to maintain its lead in the memory market.
The company says its 32GB DDR5 ICs will be made on its most advanced production node, but hasn’t disclosed data transfer rates yet. However, the devices will form the basis of 128GB DDR5 modules due out next year. Micron also has plans for 192GB and 256GB DDR5 modules in the future.
“Micron’s high-performance memory solutions serve an ever-expanding set of applications, ranging from artificial intelligence to data analytics,” the company says. “To meet the evolving needs of the tech industry, Micron is constantly working to improve memory performance and capacity.
“Building on its track record of innovation, the company plans to offer high-capacity monolithic memory devices using modern DRAM fabrication technologies. In the future, Micron will leverage its lead in advanced DRAM packaging to offer even more capacity.”
The company also plans to mass-produce 16GB and 24GB GDDR7 memory chips in mid-2024, which will likely form the basis for future graphics card memory sticks. Micron says it plans to offer 128GB GDDR7 modules based on these ICs next year, with 192GB and 256GB models also on the cards.
A big surprise from the company is that it doesn’t currently have 512GB and 1TB sticks in its roadmap, with such devices seemingly viewed as niche. However, Micron does say it plans to offer HBMNext memory in 32GB and 64GB stacks with high bandwidth “sometime in 2026 or later”.
